Mobile cooling structure and machine case having the same

ABSTRACT

A cooling structure, through a design of rail installed on an inner wall of a machine case, can be adjusted in corresponding to various electronic heating components disposed in the machine case, and freely moved to a position, where an electronic heating component is needed to conduct heat generated thereof to the machine case.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to a cooling technique, inparticular, to a cooling structure, applicable to a machine caserequiring cooling in a computer, and especially adaptable to a machinecase in an industrial computer.

2. Description of Prior Art

At present, cooling problem has become a crucial factor influencing theoperation of current computer or relative multimedia computer host. Itsimportance is without mention, because computer requires an enhancingfunction day by day.

Regarding to the cooling requirement for any heating source in acomputer, the prior art is not only to provide a most basically neededcooling capability, but also to continuously research and develop towardthe improvement of cooling efficiency. However, in terms of desktopcomputer or laptop computer, since they have an inevitable trend instandardized design, so their corresponding cooling structure or devicealso has a specifically disposing position and relationship. Therefore,they sometimes resort to redesign, only aiming to improve the coolingefficiency, without considering the match up of different interiorstructures in various computers at times. However, with respect toindustrial computer, because the positions of electronic heatingcomponents disposed therein are sometimes changed according to differentfunctions of various models, different cooling structures or devicesmust be customized according to different models, and thus thecorrespondingly disposing position and relationship may be thenfulfilled. Accordingly, if a cooling structure capable of being adjustedin corresponding to different positions of heating sources is proposed,then it can be applied so comprehensively to any type of industrialcomputer that a large amount of human labor and material resourceregarding to R&D may be saved.

Accordingly, aiming to solve aforementioned shortcomings, after asubstantially devoted study, in cooperation with the application ofrelatively academic principles, the inventor has finally proposed thepresent invention that is designed reasonably to possess the capabilityto improve the prior arts significantly.

SUMMARY OF THE INVENTION

The invention is mainly to provide a mobile cooling structure and amachine case having the same through a special design of rail, by whichthe cooling structure may be freely adjusted to specific positions incorresponding to the disposing positions of the electronic heatingcomponents in various machine cases, and thus a more flexibility may beachieved.

The invention is to provide a mobile cooling structure particularlyarranged in a machine case to facilitate a heating component arrangedtherein for a heat conduction. The cooling structure includes: tworails, respectively arranged on two inner side faces of the machinecase; a heat-conducting plate, arranged between two rails; at least oneheat pipe, attached onto the heat-conducting plate; and aheat-conducting block. According to the present invention, theheat-conducting plate is glided, in cooperation with two rails, to acorresponding position, where an electronic heating component isintended to be cooled. Then, the heat-conducting block is engagedbetween the heat-conducting plate and the electronic heating componentto undertake a heat-transferring contact, making the heat generated fromthe electronic heating component conducted to the heat-conducting plateand then extended toward the positioning direction of two rails in theheat-conducting plate through the heat pipe, thereby, the heat beingable to be conducted to the machine case for facilitating a coolingeffect.

The invention is also to provide a machine case having theaforementioned cooling structure. According to the present invention,the machine case is to provide a motherboard disposed therein, on whichan electronic heating component is arranged. Meanwhile, the machine casehas two cooling lids interspaced in parallel to each other and a coolingstructure therein. The cooling structure includes: two rails,respectively arranged on two inner side faces of the machine case; aheat-conducting plate, arranged between two rails; at least one heatpipe, attached onto the heat-conducting plate; and a heat-conductingblock. According to the present invention, the heat-conducting plate isglided, in cooperation with two rails, to a corresponding position,where the electronic heating component is intended to be cooled. Then,the heat-conducting block is engaged between the heat-conducting plateand the electronic heating component to undertake a heat-transferringcontact, making the heat generated from the electronic heating componentconducted to the heat-conducting plate, and then extended toward thepositioning direction of two rails in the heat-conducting plate throughthe heat pipe, thereby, the heat being able to be conducted to themachine case for facilitating a cooling effect.

BRIEF DESCRIPTION OF DRAWING

The features of the invention believed to be novel are set forth withparticularity in the appended claims. The invention itself, however, maybe best understood by reference to the following detailed description ofthe invention, which describes a number of exemplary embodiments of theinvention, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is an explosive illustration for showing an interior of a machinecase according to the present invention;

FIG. 2 is an assembled illustration for showing an interior of a machinecase according to the present invention;

FIG. 3 is a cross-sectional illustration for showing an interior of amachine case according to the present invention;

FIG. 4 is a cross-sectional illustration for showing a heat-conductingblock in a machine case according to another embodiment of the presentinvention; and,

FIG. 5 is an explosive illustration for showing an interior of a machinecase according to a further embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

In cooperation with attached drawings, the technical contents anddetailed description of the present invention are described thereinafteraccording to a number of preferable embodiments, being not used to limitits executing scope. Any equivalent variation and modification madeaccording to appended claims is all covered by the claims claimed by thepresent invention.

Please refer to FIG. 1 and FIG. 2, which respectively are an explosiveillustration and an assembled illustration for showing an interior of amachine case according to one preferable embodiment of the presentinvention. The invention is to provide a mobile cooling structure and amachine case having it. The machine case 1 may be a machine case ofindustrial computer and includes two cooling lids 10 interspaced inparallel to each other, a supporting plate 11 laid between two coolinglids 10, and an outer shell 12 accommodating the supporting plate 11therein.

According to above description, two cooling lids 10 are all constructedby metallic materials with excellent cooling quality and have aplurality of cooling fins 100 arranged on outer side faces thereof. Thesupporting plate 11 is horizontally connected between two inner sidefaces of two cooling lids 10 in a lower position of the machine case 1,such that a motherboard 2 is fixedly disposed on the supporting plate11. Furthermore, the outer shell 12 is assembled between two coolinglids, as shown in FIG. 2, making the motherboard 2 accommodated in themachine case 1.

Please refer to FIG. 1 and FIG. 3 together. In this preferableembodiment, the motherboard 2 has at least one electronic heatingcomponent 20 arranged thereon, for example, CPU. The cooling structureof the invention is provided for undertaking a cooling process to theelectronic heating component 20 on the motherboard 2. The coolingstructure 3 includes: two rails 30; a heat-conducting plate 31 capableof gliding on the rails 30; at least one heat pipe 32, attached on theheat-conducting plate 31; and a heat-conducting block 33 thermallycontacted under the heat-conducting plate 31. In this case, two rails 30are respectively arranged on each inner side face of two cooling lids 10in an upper position of the machine case 1. Two rails 30 are arrangedhorizontally, corresponded to each other, and extended along alongitudinal direction of two cooling lids 10, making theheat-conducting plate 31 capable of being moved between two cooling lids10 horizontally, by arranging the heat-conducting plate 31 along alongitudinal direction of two rails 30. Two rails 30 are respectivelyconstructed by two side plates 300, which are formed as long stripes300, interspaced to each other vertically, and arranged on the innerside faces of the cooling lids 10.

In this case, the heat-conducting plate 31 includes: a plate body 310,formed as a flat plate; and two gliding arms 311 extended from the platebody 310. Two gliding arms 311 can be respectively cooperative withaforementioned two rails 30, as shown in FIG. 3, making the plate body310 laid between two rails 30. The heat-conducting plate 31 can bedisplaced along a longitudinal direction of two rails 30, by thecooperation between its gliding arms 311 and the rails 30. In addition,the heat-conducting plate 31 can be further arranged a groove 312, whichis extended from the plate body 310 toward two gliding arms 311, suchthat the heat pipe 32 may be embedded in the groove 312 cooperatively.

Accordingly, as shown in FIG. 3, the heat-conducting plate 31 is firstlymoved along two rails 30, making the plate body 310 of theheat-conducting plate 31 moved to a position, which is above anelectronic heating component 20 of a motherboard 2, such that theheat-conducting block 33 is engaged between the heat-conducting plate 31and the electronic heating component 20. After the heat-conducting block33 has contacted with the electronic heating component 20, the heatgenerated from the electronic heating component 20 may be transferred tothe heat-conducting plate 31 via the heat-conducting block 33. The heatabsorbed by the heat pipe 32 arranged on the heat-conducting plate 31 isfurther transferred to at least one gliding arm 311, which contacts withtwo cooling lids 10, or the heat can be conducted to the cooling lids 10through two side plates 300. In the cooling lids 10, the conducted heatmay be dissipated to the ambience via a plurality of cooling fins 100arranged thereon.

Thereby, according to aforementioned structural composition, a mobilecooling structure and a machine case having it of the present inventionmay be obtained.

Furthermore, as shown in FIG. 4, regarding to the cooling requirement ofa plurality of electronic heating components 20, an extending plate 330may be extended laterally from the bottom of the heat-conducting block33 and contacted with other heat sources, such that the all heatgenerated from each heat sources on the motherboard 2 may be conductedout via the heat-conducting block 33.

In addition, as shown in FIG. 5, a specific aforementioned groove 312 inthe heat-conducting plate 31 may be respectively corresponded to twogliding arms 311. Since an aforementioned heat pipe 32 is respectivelyembedded in the groove 312, two heat pipes 32 may be respectivelycorresponded to a gliding arm 311 to conduct heat.

Therefore, a mobile cooling structure and a machine case having thecooling structure according to the present invention may be adjusted, incorresponding to the positions of the electronic heating components 20in a machine case 1, and particularly adaptable to an industrialcomputer. The positions of the electronic heating components 20 in anindustrial computer are so frequently changed due to the differences ofmachine model that the cooling structure 3 of the invention asaforementioned is indeed needed. Especially, the invention applies tworails 30, which are capable of position adjusting function to fulfillthe cooling requirement needed by the heat sources in each kind ofindustrial computers.

Summarizing aforementioned description, the invention is anindispensable product of novelty indeed, which may positively reach theexpected usage objective for solving the drawbacks of the prior arts,and which extremely possesses the innovation and progressiveness tocompletely fulfill the applying merits of new type patent, according towhich the invention is thereby applied. Please examine the applicationcarefully and grant it as a formal patent for protecting the rights ofthe inventor.

However, the aforementioned description is only a preferable embodimentaccording to the present invention, being not used to limit the patentscope of the invention, so equivalently structural variation made to thecontents of the present invention, for example, description anddrawings, is all covered by the claims claimed thereinafter.

1. A mobile cooling structure arranged in a machine case to facilitatean electronic heating component arranged therein for a heat conduction,the mobile cooling structure including: two rails, respectively arrangedon two inner side faces of the machine case; a heat-conducting plate,arranged between each inner side face of the two rails, and moved alongthe two rails to generate a gliding motion; a heat pipe, attached ontothe heat-conducting plate, and extended toward at least one disposingdirection of the two rails; and a heat-conducting block, engaged betweenthe heat-conducting plate and the electronic heating component to make aheat-transferring contact; wherein, the heat-conducting plate is glidedalong the two rails to a corresponding position, where the electronicheating component is intended to be cooled, and wherein theheat-conducting block is contacted between the heat-conducting plate andthe electronic heating component in a way, such that a heat generatedfrom the electronic heating component is conducted to the machine case.2. The mobile cooling structure according to claim 1, wherein the tworails are respectively constructed by two side plates that are formed astwo long stripes, which are interspaced in parallel to each other. 3.The mobile cooling structure according to claim 2, wherein the two sideplates are arranged on two inner side faces of the machine case.
 4. Themobile cooling structure according to claim 1, wherein theheat-conducting plate has a plate body and two gliding arms that areextended respectively from the plate body and matched with the tworails.
 5. The mobile cooling structure according to claim 4, wherein agroove is arranged on the heat-conducting plate and is extended from theplate body toward the two gliding arms; and the heat pipe is embeddedalong a direction of the groove.
 6. The mobile cooling structureaccording to claim 4, wherein two grooves respectively cooperated withthe two gliding arms are arranged on the heat-conducting plate and embedthe heat pipe therein.
 7. A machine case with a mobile cooling structureto provide a motherboard disposed therein, on which an electronicheating component is arranged, having two cooling lids interspaced toeach other, and being arranged the cooling structure therein, thecooling structure including: two rails, respectively arranged on eachinner side face of the two cooling lids; a heat-conducting plate,arranged between each inner side face of two rails, and moved along thetwo rails to generate a gliding motion; a heat pipe, attached onto theheat-conducting plate, and extended toward at least one disposingdirection of two rails; and a heat-conducting block, engaged between theheat-conducting plate and the electronic heating component to make aheat-transferring contact; wherein, the heat-conducting plate is glidedalong the two rails to a corresponding position, where the electronicheating component is intended to be cooled, and wherein theheat-conducting block is contacted between the heat-conducting plate andthe electronic heating component in a way, such that a heat generatedfrom the electronic heating component is conducted to two cooling lids.8. The machine case with mobile cooling structure according to claim 7,wherein a plurality of cooling fins are arranged on each outer side faceof the two cooling lids.
 9. The machine case with mobile coolingstructure according to claim 7, wherein the two rails are respectivelyconstructed by two side plates that are formed as two long stripes,which are interspaced in parallel to each other.
 10. The machine casewith mobile cooling structure according to claim 9, wherein the two sideplates are respectively arranged on an inner side face of the coolinglid.
 11. The machine case with mobile cooling structure according toclaim 7, wherein the heat-conducting plate of the cooling structure hasa plate body and two gliding arms that are extended respectively fromthe plate body and matched with the two rails.
 12. The machine case withmobile cooling structure according to claim 11, wherein a groove isarranged on the heat-conducting plate of the cooling structure and isextended from the plate body toward the two gliding arms; and the heatpipe is embedded along a direction of the groove.
 13. The machine casewith mobile cooling structure according to claim 11, wherein two groovesrespectively cooperated with the two gliding arms are arranged on theheat-conducting plate of the cooling structure and embed the heat pipetherein.